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Image of a 74HC4067 multiplexer chip in a SSOP package. They are generally available in the same pin-outs as their counterpart DIP ICs. 0000039358 00000 n
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ޟ_��L�9���xi; �h� ���mmܱ� ��K��DiƁ��R���Co7sr1�.�/ͧ��gg�������?���X�5�����ǫ3�>/?�������8s��� The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. Applications for a SSOP enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and weight. �*��nu����=�\y����S�[��Ќ��j�����/g��|]����T�/����_������{sv�����wp��R\c1q���sy�Ѹd�[Ph��
�_.ּ��]7o�Bl���[k~mi�=dאA[�}rί��)Z��⬿�s&S����B>Ԉ0�������G���`���WwpǷ��͍�|t�G7�Ha�q�`�@��\�h�U���p�䰖 Small Outline Integrated Circuit (SOIC) is a leadframe based, plastic encapsulated package, that occupies less area and has a reduced thickness compared to a dual in-line package. 0000001181 00000 n
Note: It's relatively common to find packages that contain other components than their designated ones, such as diodes or, Thin-shrink small-outline package (TSSOP), Learn how and when to remove this template message, "Package Dimensions: MSOP8/-TP, SSOP20/28, TSSOP16, TSSOP20/-TP, TSSOP24", Amkor Technology ExposedPad SOIC/SSOP Package. 0000020657 00000 n
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The ICs on DRAM memory modules were usually TSOPs until they were replaced by ball grid array (BGA). The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as 1.5 times over a standard TSSOP, thereby expanding the margin of operating parameters. However, at least TI[1] and Fairchild consistently refer to JEDEC 3.9 and 7.5 mm width parts as "SOIC" and EIAJ Type II 5.3 mm width parts as "SOP.". SOIC packages are JEDEC-compliant, and come in a variety of body widths, the most popular of which are 150 mils or 3.8 mm (narrow body) and 300 mils or 7.5 mm (wide body). Many electronic retailers will list parts in either package as SOIC whether they are referring to the JEDEC or JEITA/EIAJ standards. Small-outline integrated circuit (SOIC): dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm. 0000030096 00000 n
Small Outline Integrated Circuit (SOIC) is a leadframe based, plastic encapsulated package, that occupies less area and has a reduced thickness compared to a dual in-line package. 0000009881 00000 n
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The exposed pad should be soldered directly to the PCB to realize the thermal and electrical benefits. %PDF-1.3
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The eagle 40xx library part 4050 adds to the confusion. This yields an IC package which is a significant reduction in the size (compared to standard package). The SOIC may be shipped in tubes or tape and reel. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high frequency applications. 0000001201 00000 n
0000001984 00000 n
This high-volume industry standard package is ideal for end-products such as portable audio, video, and communications that require optimal performance with reduced size and weight. 0000011533 00000 n
:shock: :? 0000001405 00000 n
Each CAD and any associated text, image or data is in no way sponsored by or affiliated with any company, organization or real-world item, product, or good it may purport to portray. The picture below shows the general shape of a SOIC narrow package, with major dimensions. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. whats the difference bet SOIC-8 and SO-8 Package?Can I use SO-8 Package in place of SOIC-8 packege in layout ? Another SOIC variant, available only for 8-pins and 10-pins ICs, is the mini-SOIC, also called micro-SOIC. �>��[ Memory modules, disk drives, recordable optical disks, telephone handsets, speed dialers, video / audio and consumer electronics / appliances are suggested uses for TSSOP packaging. 0000030118 00000 n
0000016755 00000 n
0000029935 00000 n
A Type I TSSOP has legs protruding from the width portion of the package. 0000002235 00000 n
H�b``�b``~� S��(- �P�� ��Ϙ�x��@��K}_ 0000001881 00000 n
This case is much smaller with a pitch of only 0.5 mm. Thin small-outline package (TSOP): thinner than SOIC with smaller pin spacing of 0.5 mm. These dimensions differ depending on the SOIC in question, and there are several variants. q�����U�hJ� ��@c���t*��c�ͲV��&%�45s�j�R��gd. SOIC-8 (FS PKG Code S1) 1 : 1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0774 SOIC-8 Package Dimensions September 1998, Rev. A Type II TSSOP has the legs protruding from the length portion of the package. 0000020635 00000 n
0000001209 00000 n
The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. 0000008297 00000 n
0000029987 00000 n
� This package is commonly represented as SOx_W or SOICx_W.
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